10% OFF

ON THE TOTAL FEE

Input this Professional Credit at checkout for a max $30.00 offset.

FAST10

10% OFF

ON THE TOTAL FEE

Input this Professional Credit at checkout for a max $30.00 offset.

FAST10
** Fraud Prevention Notice      Be cautious of scams involving cloned emails and fake phone numbers requesting conference or journal fees. Only make payments via Science Net's official event platform and notify us immediately at [email protected] if you suspect fraud.

Hybrid Event

3rd - 4th October 2026 | Colombo, Sri Lanka

International Conference on Electronics Packaging and Assembly Engineering (IC-EPAE - 26)

4

Days

4

Hrs

07

Min

02

Sec

Call For Paper

The (IC-EPAE) is dedicated to advancing research excellence by bringing together leading scholars, scientists, and professionals from across the globe. It provides a platform for the dissemination of high-quality research and innovative methodologies.

With a strong focus on Electrical and Electronics Engineering, the conference promotes research that contributes to academic depth, practical insights, and interdisciplinary knowledge integration.

Authors are invited to submit papers addressing, but not limited to, the following areas:

01
Advancements in electronics packaging technologies
02
Thermal management in electronics packaging
03
Reliability testing for electronic assemblies
04
Sustainable practices in electronics packaging
05
Integration of IoT in packaging systems
06
Challenges in electronics assembly processes
07
Quality control in electronics packaging
08
Emerging materials for electronics packaging
09
Design considerations for electronic assemblies
10
Automation in electronics manufacturing
11
Future trends in electronics packaging
12
Supply chain management for electronics assembly
13
Impact of 5G on electronics packaging
14
Electromagnetic compatibility in packaging
15
Case studies in electronics packaging engineering
16
Packaging solutions for wearable electronics
17
Robustness of electronic assemblies
18
Testing methodologies for electronics packaging
19
Industry standards for electronics packaging
20
Research directions in electronics assembly

Peer Review Process

All submissions evaluated through structured peer-review to ensure academic rigor. Accepted papers may be considered for high-quality journals.

Registration Details

Secure your participation early. Limited slots are allocated on a first-come, first-served basis.

Publication Opportunities

High-quality submissions prioritized for publication in recognized journals and proceedings.

2026 UPDATE

Consistent Academic Support

Science Net ensures that research activities continue without interruption in the current global situation. Participants can engage through digital and hybrid conference formats.