10% OFF

ON THE TOTAL FEE

Input this Professional Credit at checkout for a max $30.00 offset.

FAST10

10% OFF

ON THE TOTAL FEE

Input this Professional Credit at checkout for a max $30.00 offset.

FAST10
** Fraud Prevention Notice      Be cautious of scams involving cloned emails and fake phone numbers requesting conference or journal fees. Only make payments via Science Net's official event platform and notify us immediately at [email protected] if you suspect fraud.

Hybrid Event

6th - 7th October 2026 | Berlin, Germany

International Conference on Thermal Conductivity and Material Engineering (ICTCME - 26)

Apply to Present Register as Listener
Register for Participation → View available registration categories.
4

Days

4

Hrs

07

Min

02

Sec

Call For Paper

The (ICTCME) is dedicated to advancing research excellence by bringing together leading scholars, scientists, and professionals from across the globe. It provides a platform for the dissemination of high-quality research and innovative methodologies.

With a strong focus on Heat Transfer, the conference promotes research that contributes to academic depth, practical insights, and interdisciplinary knowledge integration.

Authors are invited to submit papers addressing, but not limited to, the following areas:

01
Thermal conductivity measurement techniques
02
Materials with high thermal conductivity
03
Thermal management in electronic devices
04
Nanostructured materials for heat transfer
05
Thermal conductivity of polymers
06
Innovative thermal insulation materials
07
Heat transfer in composite materials
08
Measurement of thermal properties
09
Thermal conductivity in biomaterials
10
Applications of thermal conductivity in industry
11
Modeling thermal conductivity in materials
12
Thermal conductivity in energy systems
13
Impact of temperature on material properties
14
Thermal conductivity in nanomaterials
15
Advanced characterization techniques
16
Thermal conductivity in construction materials
17
Thermal behavior of phase change materials
18
Thermal conductivity in metals and alloys
19
Emerging materials for thermal applications
20
Future directions in thermal conductivity research

Peer Review Process

All submissions evaluated through structured peer-review to ensure academic rigor. Accepted papers may be considered for high-quality journals.

Registration Details

Secure your participation early. Limited slots are allocated on a first-come, first-served basis.

Publication Opportunities

High-quality submissions prioritized for publication in recognized journals and proceedings.

Submit Your Paper Today Register Early
2026 UPDATE

Consistent Academic Support

Science Net ensures that research activities continue without interruption in the current global situation. Participants can engage through digital and hybrid conference formats.