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Hybrid Event

22nd - 23rd July 2026 | Aleppo, Syria

International Conference on Solid State Electronics and Semiconductor Physics (ICSSESP - 26)

4

Days

4

Hrs

07

Min

02

Sec

Conference Program

Session Tracks

SDG Wheel

Aligned with

UN Sustainable Development Goals

This conference contributes to global sustainability by aligning its research discussions and academic sessions with key United Nations Sustainable Development Goals. It fosters knowledge exchange, innovation, and collaborative engagement.

Why it matters

SDG 7 — Affordable and Clean Energy
SDG 9 — Industry, Innovation and Infrastructure
SDG 12 — Responsible Consumption and Production
Explore All Session Tracks
Track 01
Advancements in Solid State Electronics

This track focuses on the latest developments in solid state electronics, emphasizing novel materials and device architectures. Participants will explore innovative approaches to enhance performance and efficiency in electronic devices.

Track 02
Semiconductor Physics and Material Properties

This session will delve into the fundamental principles of semiconductor physics, including band structure and charge transport mechanisms. Researchers are invited to present studies on the properties of various semiconductor materials and their implications for device performance.

Track 03
Nanoscale Electronics and Device Miniaturization

This track addresses the challenges and breakthroughs in nanoscale electronics, particularly in the context of device miniaturization. Contributions will highlight techniques for fabricating and characterizing nanoscale electronic components.

Track 04
Optoelectronics: Devices and Applications

This session will explore the intersection of optics and electronics, focusing on the design and application of optoelectronic devices. Topics may include photodetectors, light-emitting diodes, and their integration into modern technology.

Track 05
Thin Films and Heterostructures in Electronics

This track will examine the role of thin films and heterostructures in the development of advanced electronic devices. Presentations will cover fabrication techniques, material properties, and device performance implications.

Track 06
Charge Transport in Semiconductor Devices

This session will investigate the mechanisms of charge transport in various semiconductor devices, including MOSFETs and quantum wells. Researchers are encouraged to share experimental and theoretical insights into improving charge mobility and device efficiency.

Track 07
Spintronics: Principles and Applications

This track will focus on the principles of spintronics and its potential applications in next-generation electronic devices. Discussions will include spin transport, spin-based logic devices, and the integration of spintronics with traditional electronics.

Track 08
Quantum Wells and Their Device Applications

This session will explore the unique properties of quantum wells and their applications in semiconductor devices. Contributions will highlight advancements in fabrication techniques and the impact of quantum confinement on device performance.

Track 09
Integrated Circuits: Design and Fabrication

This track will cover the latest trends in the design and fabrication of integrated circuits, focusing on both analog and digital applications. Participants will discuss challenges in scaling and integration of new materials and technologies.

Track 10
Electronic Characterization Techniques

This session will highlight various electronic characterization techniques used to evaluate semiconductor materials and devices. Presentations will cover both established methods and emerging techniques for assessing device performance.

Track 11
Solid-State Modeling and Simulation

This track will focus on computational approaches for modeling and simulating solid-state devices. Researchers are invited to present their work on theoretical frameworks and simulation tools that advance the understanding of semiconductor physics.

2026 UPDATE

Consistent Academic Support

Science Net ensures that research activities continue without interruption in the current global situation. Participants can engage through digital and hybrid conference formats.